Decorative Plating

Nickel Plating

Our semi-bright and bright nickel processes can be used for a variety of finishing applications including in duplex or multilayer nickel systems. Processes also provide excellent leveling and coverage for plating complex geometries.

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Technical Data Sheets, SDS, Process Approvals, Troubleshooting Guides and Applicator Approvals

Product Info
  • NiCOL™ SB SIMPLICITY

    Process for semi-bright electrodeposited nickel plating that gives S.T.E.P. values that meet all OEM specifications. Single additive replenishment for simplified operation. Provides nickel plated deposits that are level, extremely ductile and have low stress.

  • NiCOL™ SB ADVANTAGE

    Process for semi-bright electrodeposited nickel plating. Dual additive replenishment for simplified operation and greater S.T.E.P. control for meeting automotive OEM specifications. Provides nickel plated deposits that are level, extremely ductile and have low stress ideal for plating on plastic substrates.

  • NiCOL™ BRIGHT INDEX

    Index based dual additive process for bright electrodeposited nickel plating. Separate additives for control of brightener and carrier individually. Used in duplex or multilayer nickel finishes where extended corrosion resistance is required. Excellent leveling, brightness and ductility for automotive applications.

  • NiCOL™ BRIGHT INDEX SINGLE

    Index based single additive process for bright electrodeposited nickel plating. Simplified operation and superb coverage for plating complex geometries. Used in duplex or multilayer nickel finishes where extended corrosion resistance is required. Excellent leveling, brightness and ductility for automotive applications.

  • NiCOL™ LEVELBRIGHT

    A true non-index based process for bright electrodeposited nickel plating. Dual additive process for control of brightener and carrier individually. Can be used in mechanical or air agitated plating solutions. Excellent leveling, brightness and ductility for automotive applications.

  • NiCOL™ LEVELBRIGHT SINGLE

    A true non-index based process for bright electrodeposited nickel plating. Single additive replenishment for simplified operation and superb coverage for plating complex geometries. Can be used in mechanical or air agitated plating solutions. Excellent leveling, brightness and ductility for automotive applications.

  • NiCOL™ ZT BRIGHT INDEX

    Zinc tolerant index based process for bright electrodeposited nickel plating. Highly recommended for plating zinc die castings. Used in duplex or multilayer nickel finishes where extended corrosion resistance is required. Excellent leveling and brightness.

  • NiCOL™ WETTER 100

    Low foaming wetting agent for use in NiCOL nickel plating processes. Helps prevent pitting in deposits from air agitated NiCOL nickel plating solutions. Provides surface tension range of 29 – 45 dynes/cm.

  • NiCOL™ WETTER 200

    Low foaming wetting agent for use in NiCOL nickel plating processes. Helps prevent pitting in deposits from air agitated NiCOL nickel plating solutions. Provides surface tension range of 38 – 50 dynes/cm.

  • NiCOL™ WETTER 300

    Low foaming wetting agent for use in NiCOL nickel plating processes. Helps prevent pitting in deposits from air agitated NiCOL nickel plating solutions. Provides surface tension range of 50 – 75 dynes/cm.

  • NiCOL™ ANTIPIT 1

    Additive to disperse organic contamination and prevent pitting in nickel plated deposits from NiCOL plating solutions. Used at low concentrations and easily removed by carbon treatment.

  • NiCOL™ BOOSTER 1

    Additive for boosting the leveling ability of non-index based electrodeposited nickel plating solutions. Highly concentrated for low consumption.

  • NiCOL™ BOOSTER 2

    Additive for boosting the brightness and leveling of bright electrodeposited nickel plating solutions. Very highly concentrated for low consumption.

  • NiCOL™ D-IRON 1

    Additive for bright electrodeposited nickel plating solutions that corrects deposit defects caused by iron contamination.

  • NiCOL™ D-ZINC 1

    Additive for bright electrodeposited nickel plating solutions that corrects deposit defects caused by zinc contamination or high brightener concentration.