Nickel Plating

Our semi-bright and bright nickel processes can be used for a variety of finishing applications including in duplex or multilayer nickel systems. Processes also provide excellent leveling and coverage for plating complex geometries. Are you getting the best leveling out of your decorative nickel? Columbia's groundbreaking nickel leveling test for new customers quantifies the exact leveling characteristics of the bath performance to quickly identify if there is a plating problem or a substrate problem.

• NICOL SULFAMATE

  Process for sulfamate nickel plating.  Operating parameters can be modified to meet engineering requirements.

• NiCOL SB SIMPLICITY

  Process for semi-bright electrodeposited nickel plating that gives S.T.E.P. values that meet all OEM specifications. Single additive replenishment for simplified operation. Provides nickel plated deposits that are level, extremely ductile and have low stress.

• NiCOL SB ADVANTAGE

  Process for semi-bright electrodeposited nickel plating. Dual additive replenishment for simplified operation and greater S.T.E.P. control for meeting automotive OEM specifications. Provides nickel plated deposits that are level, extremely ductile and have low stress ideal for plating on plastic substrates.

• NiCOL BRIGHT INDEX

  Index based dual additive process for bright electrodeposited nickel plating. Separate additives for control of brightener and carrier individually. Used in duplex or multilayer nickel finishes where extended corrosion resistance is required. Excellent leveling, brightness and ductility for automotive applications.

• NiCOL BRIGHT INDEX SINGLE

  Index based single additive process for bright electrodeposited nickel plating. Simplified operation and superb coverage for plating complex geometries. Used in duplex or multilayer nickel finishes where extended corrosion resistance is required. Excellent leveling, brightness and ductility for automotive applications.

• NiCOL LEVELBRIGHT

  A true non-index based process for bright electrodeposited nickel plating. Dual additive process for control of brightener and carrier individually. Can be used in mechanical or air agitated plating solutions. Excellent leveling, brightness and ductility for automotive applications.

  
• NiCOL LEVELBRIGHT SINGLE

  A true non-index based process for bright electrodeposited nickel plating. Single additive replenishment for simplified operation and superb coverage for plating complex geometries. Can be used in mechanical or air agitated plating solutions. Excellent leveling, brightness and ductility for automotive applications.

• NiCOL ZT BRIGHT INDEX

  Zinc tolerant index based process for bright electrodeposited nickel plating. Highly recommended for plating zinc die castings. Used in duplex or multilayer nickel finishes where extended corrosion resistance is required. Excellent leveling and brightness.

• NiCOL WETTER 100

  Low foaming wetting agent for use in NiCOL nickel plating processes. Helps prevent pitting in deposits from air agitated NiCOL nickel plating solutions. Provides surface tension range of 29 – 45 dynes/cm.

• NiCOL WETTER 200

  Low foaming wetting agent for use in NiCOL nickel plating processes. Helps prevent pitting in deposits from air agitated NiCOL nickel plating solutions. Provides surface tension range of 38 – 50 dynes/cm.

• NiCOL WETTER 300

  Low foaming wetting agent for use in NiCOL nickel plating processes. Helps prevent pitting in deposits from air agitated NiCOL nickel plating solutions. Provides surface tension range of 50 – 75 dynes/cm.

• NiCOL ANTIPIT 1

  Additive to disperse organic contamination and prevent pitting in nickel plated deposits from NiCOL plating solutions. Used at low concentrations and easily removed by carbon treatment.

• NiCOL BOOSTER 1

  Additive for boosting the leveling ability of non-index based electrodeposited nickel plating solutions. Highly concentrated for low consumption.

• NiCOL BOOSTER 2

  Additive for boosting the brightness and leveling of bright electrodeposited nickel plating solutions. Very highly concentrated for low consumption.

• NiCOL D-IRON 1

  Additive for bright electrodeposited nickel plating solutions that corrects deposit defects caused by iron contamination.

• NiCOL D-ZINC 1

  Additive for bright electrodeposited nickel plating solutions that corrects deposit defects caused by zinc contamination or high brightener concentration.